Cu
Purity 99.9999% (6N) · CAS 7440-50-8 · Cu
Copper Powder 99.9999%
6N ultra-high-purity copper powder for semiconductors, additive manufacturing and conductive pastes.
Overview
Electrolytically refined and inert-gas atomised copper powder at 99.9999% purity. Available spherical or dendritic, oxygen-controlled and packed under argon to preserve surface chemistry. Full ICP-MS trace analysis is reported per lot.
Purity grades
Each grade corresponds to a different production route and a different impurity budget. Open a grade for its typical trace analysis and applications.
| Grade | Purity | Typical use | |
|---|---|---|---|
| 2N | 99% | Friction materials, brazing pastes, bulk metallurgy | View → |
| 3N | 99.9% | Powder metallurgy, conductive fillers, MIM | View → |
| 4N | 99.99% | Additive manufacturing, conductive inks | View → |
| 5N | 99.999% | Sputtering targets, electroplating chemistry | View → |
| 6N | 99.9999% | Semiconductor interconnect, ultra-high purity PVD | View → |
| 7N | 99.99999% | Research quantities only — zone-refined | View → |
Technical data
| Purity | 99.9999% (metals basis) |
|---|---|
| Particle size | 0.5 µm – 150 µm (custom cuts) |
| Morphology | Spherical / dendritic / flake |
| Oxygen content | < 300 ppm |
| Density | 8.96 g/cm³ |
| Melting point | 1085 °C |
Applications
- ▪Sputtering target and PVD feedstock
- ▪Additive manufacturing (SLM / binder jetting)
- ▪Conductive inks and pastes
- ▪Powder metallurgy and friction materials
- ▪Thermal management composites
- ▪Catalysis and chemical synthesis
Common forms
Atomised powderNanopowderFlakeGranules